Feature(may vary by option.)
●Paste Content: Alloy Tin 42% Bi58% , Sloder Flux Content: 10.5%
●Product Parameters: Total Weight: 29g, Net Weight Of Paste: 20g
●Paste Features: No Clean, Strong Viscosity, Bright Welding Point, Particle Size: T5 (15-25 Microns)
●Product Advantages: Pushing design for Smoother Flowing, No Waste During Welding
●Applications: Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment
[T4 30g]
[T4 20g]
[T5 30g]
[T5 20g]
Description
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|---|---|---|---|---|
| Sn42/Bi58 T4 Lead Free Solder Paste（20g） | Sn42/Bi58 T4 Lead Free Solder Paste（30g） | Sn42/Bi58 T5 Lead Free Solder Paste（20g） | Sn42/Bi58 T5 Lead Free Solder Paste（30g） | |
| Weight | 20g | 30g | 20g | 30g |
| Advantage | Lead Free & No Clean | Lead Free & No Clean | Lead Free & No Clean | Lead Free & No Clean |
| Particle size（Microns） | 20~38 | 20~38 | 15~25 | 15~25 |
Sn42/Bi58 Solder Paste Features:
Applications:
Usage Guidelines:
