Feature

●Connecting Chips and PCBs: These solder balls can be used to connect semiconductor chips, circuit modules and PCB boards, providing great convenience.
●Stable And Durable: Tin solder ball for BGA reballing come with stable structure, excellent performance and long service life.
●Stable And Durable: Tin solder ball for BGA reballing come with stable structure, excellent performance and long service life.
●Sufficient Quantity: Available in a variety of different sizes, there are seven bottles in total, each containing approximately 12,500 solder balls to meet your basic soldering needs.
●Durable Tin Material: This solder ball is made of good quality tin material, stable, durable and can be used for a long time.


Description

Specification:
Item Type: Tin Solder Ball
Material: Tin
Specifications: 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6mm
Application: Tin balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic

Package List:
7 Bottles of Tin Solder Ball